HVI-series Thermal Warpage Inspection System

随着电子产品高度集成化,为了防止在回流焊等过程中出现虚焊等缺陷,对于芯片,PCB,连接器等的变形控制越来越严格,尤其是在回流焊过程中的变形监控越来越严格,本文介绍一种新型测试技术,使用共聚焦显微系统结合回流焊模拟装置,高精度测量和模拟回流焊过程中,芯片,PCB,连接器等变形情况。

HVI-8000-RC-1170-500

Inspection items/Applications

For substrate package simulation, R&D of substrate, development of substrate material, development of camera module, environmental test for automotive applications

Features

Thermal Warpage Inspection, Warpage Measurement, Reflow Warpage Simulation

Same as the conventional HVI-8000-RC/EC model, it is possible to perform warpage inspection under reflow temperature or set temperature conditions, without the need for sample preparation such as bump removal nor paint treatment required by a general warpage inspection apparatus. Applicable work size is max. 100x100mm, and a high-speed convection heater capable of heating speed 3℃/sec is included.

Specifications

HVI-8000C Thermal Warpage Inspection System

HVI-8000C-RCHVI-8000C-EC
Main useReflow simulationEnvironmental test
Main inspection itemSubstrate WarpageSubstrate Warpage
Bump HeightBump Height
Bump CoplanarityBump Coplanarity
FOV12.8mm×12.8mm12.8mm×12.8mm
RangeMax. 4mmMax. 4mm
XY Resolution8.0μm8.0μm
Z Resolution0.1μm0.1μm
Heating temperatureRoom temperature ~ 300℃-55℃ ~ 260℃ (Target)
Heating velocity3℃/s or more3℃/s or more
Accuracy in warpage3σ ≦ 2μm3σ ≦ 2μm
Accuracy in height3σ ave. ≦ 1.5μm3σ ave. ≦ 1.5μm
Dimension(W) 850mm×(D) 1,240mm×(H) 1,240mm(W) 850mm×(D) 1,240mm×(H) 1,240mm
HVI-8000-EC-1170-500

Inspection items/Applications

For substrate package simulation, R&D of substrate, development of substrate material, development of camera module, environmental test for automotive applications

Features

Thermal Warpage Inspection, Warpage Measurement, Reflow Warpage Simulation

Our system can perform warpage inspections at a reflow temperature or during heating with bumps and parts mounted on a substrate, and preprocessing for the removal of bumps and spray treatment as required for general warpage inspection systems that are no longer required. The variation in the warpage of substrate and the behavior of bumps can be observed simultaneously. With this system, measurement can be performed in a process that is close to actual reflow and environmental test processes. The temperature can be set to up to 64 steps ranging from -55°C to max. 300°C. Applicable work size is max. A4 size.

Specifications

HVI-8000 Thermal Warpage Inspection System

HVI-8000-RCHVI-8000-EC
Main useReflow simulationEnvironmental test
Main inspection itemSubstrate WarpageSubstrate Warpage
Bump HeightBump Height
Bump CoplanarityBump Coplanarity
FOV13.0mm×13.0mm13.0mm×13.0mm
RangeMax. 4mmMax. 4mm
XY Resolution8.0μm8.0μm
Z Resolution0.1μm0.1μm
Heating temperatureRoom temperature ~ 300℃-55℃ ~ 260℃ (Target)
Heating velocity2℃/sec25℃ → 220℃ Within 10 minutes
Cooling velocity25℃ → -220℃ Within 7 minutes
Accuracy in warpage3σ ≦ 2μm3σ ≦ 2μm
Accuracy in height3σ ave. ≦ 1.5μm3σ ave. ≦ 1.5μm
Dimension(W)2000mm×(D)2,015mm×(H)1,800mm(W)2000mm×(D)2,015mm×(H)1,800mm