iPlasma Laser Plasma decap

传统化学开封机及激光开封机已在市场使用多年,具有成本低廉及快速开封的重要特性,但是随着日益多样化、复杂化的封装形式,绑线引入铜线,铝线,银线等等,激光开封机和后续的化学开封机或手工滴酸,对于部分产品无法开封或具有破坏性,尤其是强酸对人员的安全造成威胁,推荐使用开芯有限公司推出的等离子开封机,可以将高效,安全,无损伤融合一起,作为更高阶的开封解决方案,尤其推荐激光等离子开封一体机。 其优点表现在: 1.全程不需要使用强酸等化学试剂,保护人员安全 2.无需CF4等有毒气体,人员安全和不会腐蚀钝化层 3.一台机器实现激光预处理和等离子后期处理,大大缩短开封时间; 4.充分考虑多种封装形式的开封,实现参数保存,增强开封的一致性; 5.全程自动化控制,可实现一次开多颗芯片,缩短开封时间 开芯有限公司介绍:开芯是一家致力于提供优质芯片开封工具的香港科技公司,主要人员拥有超过10年的化学,激光,等离子技术的背景,公司业务包括开封设备和技术的开发、生产、销售。

Plasma decap

Traditional chemical decapsulation machines and laser decapsulation machines have been used in the market for many years, with important characteristics of low cost and fast decapsulation. However, with increasingly diverse and complex packaging forms such as wire bonding with copper, aluminum, silver, etc., laser decapsulation machines and subsequent chemical decapsulation machines or manual acid droppers…

laser decap

  Introduction to Laser Decap: The laser decapsulation machine is used to remove the encapsulation material from electronic components, specifically by using laser technology. In recent years, there has been an increase in copper wire products, and customers have increasingly higher requirements for decapsulation, leading to the demand for laser decapsulation machines. These machines are…